Testing, Evaluation, & Quality Control
Performance testing that connects characterization of basic material properties with integrated device and subsystem functional requirements to assist the development of new products.
Separation Chromatography
•HPLC (RI & PDA detectors)
•UPLC (PDA & MS/MS detectors)
•GPC, APC (RI detector)
•GC-FID, Headspace-GC-FID (TCD & MS detectors)
•Ion Chromatography
•Preparatory HPLC-PDA & GPC-RI
Spectroscopy
•UV-Vis Spectrometer
•FT-IR Spectrometer
•Fluorescence Spectrometer
•Tintometer for Color Analysis
•NMR (400 MHz, 1H, 13C, 15N, 19F, 31P)
•Colorimetric Analysis
Microscopy
•Optical Microscopy (digital with 3D imaging & variable temperature capabilities
•SEM, SEM-EDS
•TEM (with staining)
Elemental Analysis
•ICP-OES
•CHN (LECO 628 System)
•Oxygen Determination (LECO VTF-900)
•Sulphur Analyzer (LECO S-932)
Particle Analysis
•Nanotrac 252 Particle Size Analyzer
•SYSMEX 3000 FPIA (Particle size and shape)
•Beckman Coulter Multisizer 3
•Malvern Nanosizer
•Malvern Zetasizer (Zeta potential)
•Powder X-Ray Diffraction (XRD)
•Surface Area Analysis (BET)
Mechanical Characterization
•DMA (Q800)
•Rheology
-High-temp, strain controlled (Ares G2 & RFS3)
-Medium to high viscosity materials (DHR-2)
•Hardness (Durometer)
•Abrasion/rub
-Sutherland tester
-linear/rotary taber abraders
-RT4 rotary abrader)
•Friction and wear
-Pin-on-disk
-Linear reciprocating tribometer
•Thermal diffusivity and conductivity of films (Nanoflash)
•Thermal conductivity of solids (C-Therm)
•Impact testing (Tinius Olsen)
•Instron 3367 mechanical testing
-temperature-controlled stress, strain, creep, stress relaxation, peel, and delamination
Electrical Characterization
•Cyclic Voltammetry
•Photocurrent time-of-flight charge transport
•Current/voltage measurement
-Temperature and humidity-controlled environments
•Magnetic remanence and susceptibility (fixed field)
•Static charge decay
-JCI155 corona charge decay analyser
•Transistor characterization (Keithly 4200)
•Semiconductor evaluation
-Top contact, bottom contact device preparation
-Mobility, on-off voltage measurements
•Resistivity/conductivity – surface and volume
¡Keithley 65174 4 probe & 2 probe
Thermal Analysis
•Differential Scanning Calorimeter (DSC)
•Modulated Differential Scanning Calorimeter (MDSC)
•Thermogravimetric Analysis (TGA)
•Melt Flow Index (MFI)
•Rheology (temperature & frequency sweep)
•Brookfield Viscometer
•Reaction Calorimetry (RC)
Surface Film Characterization
•Surface tension (Tensiometer K100)
•Surface profilometry
-Nanovea optical profiler
-Dektek 6 contact profilometer
•Contact angle
-temperature-controlled static, dynamic, and sliding angles (FibroDAT and FTA200)
•Film thickness
-contact/non-contact (Metricon)
•Co-efficient of friction (TMI Slip and Friction)
•Surface roughness
-L&W Sheffield tester
-Toyo-Seiki Microtopograph dynamic roughness
tester
•Porosity, Pore Size Distribution
-L&W permeance tester
-Coulter porometer
•Tensile and Modulus
-TMI ZDT tensile tester
-SST250 ultrasonic modulus tester
Titration Units
•Karl Fischer
•Potentiometric Titrations (pH, amine, acid numbers)
•Conductometric Titrations